4. Semiconductor device manufacturing: process
  5. Coating with electrically or thermally conductive material
  6. To form ohmic contact to semiconductive material

Yonggang Jin

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Method of manufacturing different bond pads on the same...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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System for different bond pads in an integrated circuit package

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Solder wettable contact – lead – or bond
Reexamination Certificate

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System for fabricating an integrated circuit package on a...

Metal fusion bonding – Process – With protecting of work or filler or applying flux
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Profile ID: LFUS-PAI-P-2986705

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