System for fabricating an integrated circuit package on a...

Details System for fabricating an integrated circuit package on a... System for fabricating an integrated circuit package on a...

2007-12-11

2007-12-11

Stoner, Kiley (Department: 1725)

Metal fusion bonding

Process

With protecting of work or filler or applying flux

C228S221000, C228S248100

Reexamination Certificate

active

10825810

ABSTRACT:
A system is provided for reflow soldering a part that includes: replacing air around an unsoldered part with a first inert gas; removing the first inert gas to form a vacuum around the unsoldered part; vacuum reflow soldering the unsoldered part to form a reflow-soldered part; providing a second inert gas to fill the vacuum around the reflow-soldered part; and replacing the second inert gas with air around the reflow-soldered part.

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Merriam-Webster's Collegiate Dictionary, 10th edition, 1999, pp. 1197-1198.
Merriam-Webster's Collegiate Thesaurus, 1988, pp. 747-748.

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