4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Including contaminant removal or mitigation

Yong-Chai Kwon

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Image sensor device and method of manufacturing same

Active solid-state devices (e.g. – transistors – solid-state diode – Responsive to non-electrical signal – Electromagnetic or particle radiation
Reexamination Certificate

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Image sensor device and methods thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Image sensor device and methods thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including contaminant removal or mitigation
Reexamination Certificate

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Method of fabricating semiconductor package structure

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Semiconductor device having through vias

Active solid-state devices (e.g. – transistors – solid-state diode – Physical configuration of semiconductor – With electrical contact in hole in semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2370178

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