4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Multiple housings

Yi-Shao Lai

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Bonding strength measuring device

Thermal measuring and testing – Leak or flaw detection – With heating or cooling of specimen for test
Reexamination Certificate

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Semiconductor package and method for making the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Reexamination Certificate

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Tenon-and-mortise packaging structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Multiple housings
Reexamination Certificate

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Tensile test method

Measuring and testing – Specimen stress or strain – or testing by stress or strain... – By loading of specimen
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2234655

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