4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Making plural separate devices

Yeon Ho Choi

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Electronic device package and leadframe

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Electronic device package and leadframe and method for...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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Increased I/O leadframe and semiconductor device including same

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Lead frame used for the fabrication of semiconductor...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Semiconductor device including leadframe having power bars...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With separate tie bar element or plural tie bars
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2086166

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