Soldering method and soldering apparatus

Details Soldering method and soldering apparatus Soldering method and soldering apparatus

1996-09-11

1999-03-09

Ryan, Patrick

Metal fusion bonding

Process

Plural joints

228 447, 228 495, B23K 3102, B23K 3704

Patent

active

058789421

ABSTRACT:
Methods and apparatuses to perform soldering while the chip is held by a head under melted solder condition are disclosed. Solder bumps 3 are formed on the chip 1, and they are opposite to terminals 11 on a mounting board 10. Furthermore, a heating block 21 is located at the back of the chip, and it raises the temperature of the solder bumps 3 on the chip 1 to a melting point by heating the chip back by conduction. Preferably, another heating block 22 is located at the back of the mounting board 10. Soldering is performed by bringing the solder bumps 3 into contact with the terminals 11 while the solder is melted.

REFERENCES:
patent: 4693770 (1987-09-01), Hatada
patent: 4808769 (1989-02-01), Nakano et al.
patent: 5551627 (1996-09-01), Leicht et al.
patent: 5611481 (1997-03-01), Akamatsu et al.
patent: 5739053 (1998-04-01), Kawakita et al.

Affiliated with

Also associated with

Rating

Soldering method and soldering apparatus does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Soldering method and soldering apparatus, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Soldering method and soldering apparatus will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-1313034