4. Electricity: measuring and testing
  5. Fault detecting in electric circuits and of electric components
  6. Of individual circuit component or element

Yang-Hui Fang

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Bond pad structures and semiconductor devices using the same

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Method for measuring the kink effect of a semiconductor device

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Patent

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Method of forming shallow trench isolation

Semiconductor device manufacturing: process – Formation of electrically isolated lateral semiconductive... – Grooved and refilled with deposited dielectric material
Reexamination Certificate

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Profile ID: LFUS-PAI-P-589136

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