4. Error detection/correction and fault detection/recovery
  5. Pulse or data error handling
  6. Memory testing

Wu-Der Yang

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Chip scale package socket for various package sizes

Electrical connectors – Preformed panel circuit arrangement – e.g. – pcb – icm – dip,... – With provision to conduct electricity from panel circuit to...
Reexamination Certificate

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Double capacity stacked memory and fabrication method thereof

Static information storage and retrieval – Hardware for storage elements
Reexamination Certificate

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Fuse and fuse window structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Fuse structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Fuse structure

Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1906948

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