Chip scale package socket for various package sizes

Details Chip scale package socket for various package sizes Chip scale package socket for various package sizes

2006-02-21

2006-02-21

Prasad, Chandrika (Department: 2839)

Electrical connectors

Preformed panel circuit arrangement, e.g., pcb, icm, dip,...

With provision to conduct electricity from panel circuit to...

C439S071000, C439S073000

Reexamination Certificate

active

07001185

ABSTRACT:
A chip socket scale package. The package presents combined compatibility with two different chip scale package types with solder balls in same position, thereby using only one chip socket scale package.

REFERENCES:
patent: 4846703 (1989-07-01), Matsuoka et al.
patent: 6027355 (2000-02-01), Ikeya
patent: 6485321 (2002-11-01), Trout et al.

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