Method and apparatus for forming a metallic feature on a...

Details Method and apparatus for forming a metallic feature on a... Method and apparatus for forming a metallic feature on a...

2006-04-11

2006-04-11

Barr, Michael (Department: 1762)

Coating processes

With pretreatment of the base

Preapplied reactant or reaction promoter or hardener

C427S305000, C427S306000, C427S316000, C427S271000, C427S430100, C427S404000, C427S443100

Reexamination Certificate

active

07026012

ABSTRACT:
A method of forming a metallic feature on a substrate, comprising the steps of: providing a stamp having a raised region; depositing catalytic particles on a selected area of the stamp, including the raised region thereof; providing a substrate; applying the stamp to the substrate, such that the raised region of the stamp causes a corresponding indented region in the substrate and at least some of the catalytic particles are transferred to a selected area of the substrate; and plating the selected area of the substrate.

REFERENCES:
patent: 6060121 (2000-05-01), Hidber et al.
Boonekamp et al., “Adsorption of Nanometer-Sized Palladium Particles on Si(100) Surfaces”, Langmuir, 10, American Chemical Society, 1994, ppgs. 4089-4094.
Boonekamp et al., Adsorption of Nanometer-Sized Palladium Particles on Si(100) Surfaces, 10 Langmuir 4089-4094 (American Chemical Society, 1994).
Hidber et al., Microcontact Printing of Palladium Colloids: Micron-Scale Patterning by Electroless Deposition of Copper, 12 Langmuir 1375-80 (American Chemical Society, 1996).
Hidber et al., New Strategy for Controlling the Size and Shape of Metallic Features Formed by Electroless Deposition of Copper: Microcontact Printing of Catalysts on Oriented Polymers, Followed by Thermal Shrinkage, 12 Langmuir 5209-5215 (American Chemical Society, 1996).

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