4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor
  6. Metallic housing or support

William Riis Hamburgen

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Hollow chip package and method of manufacture

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Lap-top enclosure having surface coated with heat-absorbing...

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Method and apparatus for reducing battery power consumption...

Telecommunications – Transmitter and receiver at same station – Radiotelephone equipment detail
Reexamination Certificate

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Paddleless molded plastic semiconductor chip package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Metallic housing or support
Patent

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Software-directed, energy-aware control of display

Data processing: generic control systems or specific application – Generic control system – apparatus or process – Sequential or selective
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1309621

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