4. Semiconductor device manufacturing: process
  5. Semiconductor substrate dicing
  6. Having specified scribe region structure

William John Nelson

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Apparatus for attaching resists and wafers to substrates

Adhesive bonding and miscellaneous chemical manufacture – Surface bonding means and/or assembly means therefor – With separate heating means for work
Reexamination Certificate

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Leaded semiconductor device package for use in nonsoldering...

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
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Method for fabricating passivated semiconductor devices

Semiconductor device manufacturing: process – Semiconductor substrate dicing – Having specified scribe region structure
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Trench DMOS device with improved drain contact

Active solid-state devices (e.g. – transistors – solid-state diode – Field effect device – Having insulated electrode
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Trench DMOS device with improved drain contact

Semiconductor device manufacturing: process – Making field effect device having pair of active regions... – Having insulated gate
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Profile ID: LFUS-PAI-P-2083420

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