4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Bump leads

William J. Reeder

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Alignment and orientation features for a semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Alignment marks
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Alignment and orientation features for a semiconductor package

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Methods of encapsulating selected locations of a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Methods of encapsulating selected locations of a...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Including adhesive bonding step
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2655328

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