4. Metal fusion bonding
  5. Process
  6. Preplacing solid filler

William H. Brearley

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Dry etchback of interconnect contacts

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Integrated method for etching of BLM titanium-tungsten...

Metal fusion bonding – Process – Preplacing solid filler
Reexamination Certificate

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Reactive Ion Etching chamber design for flip chip...

Etching a substrate: processes – Gas phase etching of substrate – Application of energy to the gaseous etchant or to the...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2069395

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