Active solid-state devices (e.g. – transistors – solid-state diode – Integrated circuit structure with electrically isolated... – Passive components in ics
Reexamination Certificate
2004-09-23
2008-08-26
Chambliss, Alonzo (Department: 2892)
Active solid-state devices (e.g., transistors, solid-state diode
Integrated circuit structure with electrically isolated...
Passive components in ics
C257S713000, C257S717000, C257S724000, C257S782000, C257SE23105, C361S709000, C361S782000, C438S122000
Reexamination Certificate
active
07417299
ABSTRACT:
A direct connection multi-chip semiconductor element structure is proposed. A plurality of semiconductor chips are mounted and supported on a metal heat sink, such that heat generated by the chips during operation can be dissipated via the heat sink. A circuit structure is extended from the chips to provide direct electrical extension for the chips and improve the electrical performances. And exposed electrical connection terminals can be formed in the circuit structure extended from the chips to be directly electrically connected to an external electronic device.
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Chambliss Alonzo
Clark & Brody
Nixon William F.
Phoenix Precision Technology Corporation
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