4. Static information storage and retrieval
  5. Systems using particular element
  6. Magnetoresistive

Werner Robl

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Integration scheme for metal gap fill, with fixed abrasive CMP

Semiconductor device manufacturing: process – Chemical etching – Combined with the removal of material by nonchemical means
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Liner with poor step coverage to improve contact resistance...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Low Cu percentages for reducing shorts in AlCu lines

Etching a substrate: processes – Forming or treating electrical conductor article
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Method of eliminating back-end rerouting in ball grid array...

Semiconductor device manufacturing: process – Making device array and selectively interconnecting – Using structure alterable to nonconductive state
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Method of making an integrated circuit including...

Electrolysis: processes – compositions used therein – and methods – Electrolytic coating – Depositing predominantly single metal coating
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Profile ID: LFUS-PAI-P-2251354

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