4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Encapsulated

Wei-Chun Kung

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Process and structure for semiconductor package

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Substrate strip for use in packaging semiconductor chips

Active solid-state devices (e.g. – transistors – solid-state diode – Encapsulated
Reexamination Certificate

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Substrate strip for use in packaging semiconductor chips and...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2035133

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