Ultrasonic apparatus and method for placing individual chips of

Details Ultrasonic apparatus and method for placing individual chips of Ultrasonic apparatus and method for placing individual chips of

1994-04-05

1996-01-02

Simmons, David A.

Adhesive bonding and miscellaneous chemical manufacture

Methods

Surface bonding and/or assembly therefor

156 69, 156293, 1563082, 1563084, 156556, 156569, 1565801, 1565802, 354275, 354277, B32B 3102, B32B 3104, G03B 1726

Patent

active

054805015

ABSTRACT:
An ultrasonic apparatus and method for placing individual pillowed chips of light lock material in a cartridge are provided. A vacuum plate mounted on a pivotable arm picks up a chip and releases it into a cartridge. The cartridge has a recessed area into which the pillowed edge of the chip fits. Once positioned with the cartridge, utilizing a tuck plate, the chip is sealed in place using an ultrasonic horn.

REFERENCES:
patent: 3537376 (1967-11-01), Fleming
patent: 3657033 (1972-04-01), Sager
patent: 5219128 (1993-06-01), Mizuno
patent: 5246521 (1993-09-01), Shimura et al.
patent: 5368664 (1994-11-01), Sugiyama et al.

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