Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Patent
1997-06-25
1999-02-16
Brown, Peter Toby
Active solid-state devices (e.g., transistors, solid-state diode
Combined with electrical contact or lead
Bump leads
257737, 257780, 257781, 257783, H06K 114, H01L 2160
Patent
active
058724001
ABSTRACT:
A solder ball structure having a first object and least one solder ball, each solder ball having an outer surface, top and a bottom and comprising a non-eutectic admixture of solder. The solder ball structure also having at least one BLM, each BLM having a top and a bottom and the top of each BLM in contact with the bottom of one of the at least one solder ball, each BLM containing a solder having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each BLM can reflow without a significant portion of the corresponding solder ball reflowing, the bottom of each at least one BLM in electrical communication with the first object. The solder ball structure further having at least one solder ball coating, each coating in contact with one of the at least one solder ball over at least the portion of the solder ball surface not in contact with the corresponding BLM; each coating having a melting point sufficiently lower than the melting point of the corresponding solder ball such that each coating can reflow without a significant portion of the corresponding solder ball reflowing.
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Chapman Brian D.
Ma Wai Mon
Petrone James J.
Brown Peter Toby
Duong Hung Van
International Business Machines - Corporation
Townsend Tiffany L.
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