4. Optics: measuring and testing
  5. By dispersed light spectroscopy
  6. With sample excitation

Vincent James McGahay

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Bond pad structure and method for reduced downward force...

Metal fusion bonding – With means to juxtapose and bond plural workpieces – Strip leading end to trailing end bonder
Reexamination Certificate

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Insulator for integrated circuits and process

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
Reexamination Certificate

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Method and apparatus for determining chamber cleaning end point

Optics: measuring and testing – By dispersed light spectroscopy – With sample excitation
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Profile ID: LFUS-PAI-P-561403

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