4. Adhesive bonding and miscellaneous chemical manufacture
  5. Differential fluid etching apparatus
  6. With etchant gas supply or exhaust structure located outside...

Vikash Banthia

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Gap-fill depositions in the formation of silicon containing...

Semiconductor device manufacturing: process – Coating of substrate containing semiconductor region or of... – Insulative material deposited upon semiconductive substrate
Reexamination Certificate

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Gas flow control in a wafer processing system having...

Adhesive bonding and miscellaneous chemical manufacture – Differential fluid etching apparatus – With etchant gas supply or exhaust structure located outside...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2813052

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