Controlled collapse chip connection (C4) integrated circuit...

Details Controlled collapse chip connection (C4) integrated circuit... Controlled collapse chip connection (C4) integrated circuit...

2006-11-28

2006-11-28

Graybill, David E. (Department: 2822)

Semiconductor device manufacturing: process

Making device or circuit responsive to nonelectrical signal

Responsive to electromagnetic radiation

C438S106000, C438S117000

Reexamination Certificate

active

07141448

ABSTRACT:
An integrated circuit package which may include the dispense of a second encapsulant material (or fillet) different from the first underfill material on an integrated circuit package which may include an integrated circuit that is mounted to a substrate. The package may further have a first underfill material and a second underfill material that are attached to the integrated circuit and the substrate. The second encapsulant material may be tailored to inhibit cracking of the epoxy itself that propagates into the substrate during thermo-mechanical loading.

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