4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package

United Test & Assembly Center Limited

Corporate Assignee

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Details

Corporate Assignee

active

No affiliations

Multiple chip semiconductor packages

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package
Reexamination Certificate

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Packaging of a microchip device

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Wire contact – lead – or bond
Reexamination Certificate

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Packaging of a microchip device

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Making plural separate devices
Reexamination Certificate

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