Packaging of a microchip device

Details Packaging of a microchip device Packaging of a microchip device

2006-10-31

2006-10-31

Vu, David (Department: 2818)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Making plural separate devices

C257S787000

Reexamination Certificate

active

07129115

ABSTRACT:
A method of packaging a microchip device, an interposer for packaging, and a packaged microchip device. An interposer is placed on microchip devices. The interposer includes an aperture which extends from the interposer surface where external electrical contacts are located to the surface of the microchip devices. Electrical contacts on the microchip device surface are accessible through the aperture in order to electrically connect the electrical contacts with the external electrical contacts of the interposer. The interposer includes separate openings or aperture regions, in particular separated by a bridge, which extend from the interposer surface where the external contacts are located into the interposer. This facilitates the handling of the finalized package and allows for satisfactory filling of the aperture with filling material.

REFERENCES:
patent: 6677675 (2004-01-01), Bolken

Affiliated with

Also associated with

Rating

Packaging of a microchip device does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Packaging of a microchip device, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Packaging of a microchip device will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-3659376