4. Electricity: measuring and testing
  5. Fault detecting in electric circuits and of electric components
  6. Of individual circuit component or element

UMC Japan

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Analytical simulator and analytical simulation method and...

Computer-aided design and analysis of circuits and semiconductor – Nanotechnology related integrated circuit design
Reexamination Certificate

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Bump ball crimping apparatus

Metal working – Means to assemble or disassemble – With control means energized in response to activator...
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Bump forming method and apparatus for heating and...

Semiconductor device manufacturing: process – Coating with electrically or thermally conductive material – To form ohmic contact to semiconductive material
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Cantilever type probe card and method for production thereof

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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LSI inspection method and defect inspection data analysis...

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
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Profile ID: LFUS-PAI-P-2315829

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