Bump ball crimping apparatus

Details Bump ball crimping apparatus Bump ball crimping apparatus

2005-11-01

2005-11-01

Cozart, Jermie E. (Department: 3726)

Metal working

Means to assemble or disassemble

With control means energized in response to activator...

C029S759000, C029S407090, C029S407100, C029S464000, C029S468000, C029S281100, C029S281400, C029S559000, C269S2890MR

Reexamination Certificate

active

06959485

ABSTRACT:
The bump ball crimping apparatus of the present invention is characterized in comprising an alignment plate31for aligning bump balls; a crimping table32on which the wafer to which bump balls are to be crimped is mounted; a crimping plate42that crimps the bump balls onto the bonding pads of the wafer; a Y-axis moving mechanism35that can move the alignment plate31in the Y direction and can fasten it at a predetermined position; an X-axis moving mechanism that can move the alignment plate31in the X direction and can fasten it at a predetermined position; and a second Y-axis moving mechanism37that can move the crimping table32in the Y direction and can fasten it at a predetermined position.

REFERENCES:
patent: 5831247 (1998-11-01), Hidaka
patent: 9-82748 (1997-03-01), None
patent: 11243105 (1999-09-01), None

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