4. Radiation imagery chemistry: process, composition, or product th
  5. Imaging affecting physical property of radiation sensitive...
  6. Forming nonplanar surface

Tzong-Ming Lee

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Reexamination Certificate

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Chip package structure

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Chip package structure and process for fabricating the same

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Housing or package filled with solid or liquid electrically...
Reexamination Certificate

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Composition for thermal interface material

Compositions – Liquid crystal compositions
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Dielectric compositions having two steps of laminating...

Synthetic resins or natural rubbers -- part of the class 520 ser – Synthetic resins – Processes of preparing a desired or intentional composition...
Reexamination Certificate

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Profile ID: LFUS-PAI-P-74277

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