Composition for thermal interface material

Details Composition for thermal interface material Composition for thermal interface material

2006-05-01

2010-02-16

Egwim, Kelechi C (Department: 1796)

Compositions

Liquid crystal compositions

C349S001000, C524S356000

Reexamination Certificate

active

07662307

ABSTRACT:
A composition for a thermal interface material is provided. The deficiencies of low thermal conductivity and high thermal resistance in the conventional thermal interface materials are resolved. The CNT-LC thermal composite structure is formed by using carbon nanotube with high thermal conductivity and liquid crystal polymer with the well-ordered structure. The thermal interface material thereby has a high thermal conductivity. The added amount of carbon nanotube is less than the added amount of metal or ceramic powders in the prior art for improving the dispersion process. The CNT-LC thermal composite structure and the phase change resin are compatible without phase separation. The thermal interface material has a phase change temperature about 45˜75° C. Any holes, gaps and dents on the surface of device are filled at the normal operating temperature of device to reduce the thermal resistance of the entire device.

REFERENCES:
patent: 6407922 (2002-06-01), Eckblad et al.
patent: 6451422 (2002-09-01), Nguyen
patent: 2003/0203181 (2003-10-01), Ellsworth, Jr. et al.
patent: 2004/0000661 (2004-01-01), Sato
patent: 2005/0150887 (2005-07-01), Taya et al.
patent: 2005/0171269 (2005-08-01), Hu et al.
patent: 2004263043 (2004-09-01), None
patent: WO 2004025761 (2004-03-01), None

Affiliated with

Also associated with

Rating

Composition for thermal interface material does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Composition for thermal interface material, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Composition for thermal interface material will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-4210732