4. Semiconductor device manufacturing: process
  5. Packaging or treatment of packaged semiconductor

Tzong-Dar Her

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Crack-preventive substrate and process for fabricating...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Heat dissipation ball grid array package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Method for identifying defective elements in array molding...

Semiconductor device manufacturing: process – With measuring or testing – Packaging or treatment of packaged semiconductor
Reexamination Certificate

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Multi-chip packaging having non-sticking test structure

Electricity: measuring and testing – Fault detecting in electric circuits and of electric components – Of individual circuit component or element
Reexamination Certificate

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Quad flat non-leaded package and leadframe for use in a quad...

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2058266

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