4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Combined with electrical contact or lead
  6. Ball or nail head type contact, lead, or bond

tung & Associates

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Device for bump probing and method of fabrication

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Ball or nail head type contact – lead – or bond
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Elimination of address-sensitivity by synchronous reference...

Static information storage and retrieval – Read/write circuit – Including signal comparison
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Floating plug valve apparatus for storing and dispensing...

Fluid handling – Systems – System with plural openings – one a gas vent or access opening
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Method and apparatus for removing coating layers from...

Etching a substrate: processes – Nongaseous phase etching of substrate – Projecting etchant against a moving substrate or controlling...
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Method for improved plasma etching control

Semiconductor device manufacturing: process – Chemical etching – Vapor phase etching
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