4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Tsung-Chieh Chen

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Dual-sided heat dissipating structure for integrated circuit...

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Reexamination Certificate

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Enhanced heat dissipating chip scale package method and devices

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Method for fabricating a dual-chip package and package formed

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Assembly of plural semiconductive substrates each possessing...
Reexamination Certificate

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Method for wire bonding a chip to a substrate with recessed...

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Insulative housing or support
Reexamination Certificate

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Modified lead finger for wire bonding

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame
Patent

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Profile ID: LFUS-PAI-P-398614

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