4. Metal fusion bonding
  5. Process
  6. Metal to nonmetal with separate metallic filler

Tsuneyuki Sukegawa

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Ceramic substrate for electrical devices

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Method of connecting metal conductor to ceramic substrate

Metal fusion bonding – Process – Metal to nonmetal with separate metallic filler
Patent

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Process for producing multilayer circuit board

Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent

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Substrate for an integrated circuit

Stock material or miscellaneous articles – Structurally defined web or sheet – Discontinuous or differential coating – impregnation or bond
Patent

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Profile ID: LFUS-PAI-P-329787

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