Coating processes – Electrical product produced – Integrated circuit – printed circuit – or circuit board
Patent
1986-08-28
1989-03-07
Beck, Shrive
Coating processes
Electrical product produced
Integrated circuit, printed circuit, or circuit board
427 97, 4273835, B05D 512
Patent
active
048105287
ABSTRACT:
A process for producing a multilayer circuit board composed of crystallized glass and copper-metallized circuit patterns, which comprises:
(1) providing a green sheet of a crystallizable glass powder;
(2) providing a copper paste comprising copper component (copper and/or copper oxide) and a glass powder in a proportion by weight of the copper component to the glass powder 95:5 to 75:25, copper oxide being calculated on copper;
(3) printing a circuit pattern of the copper paste of step (2) on the green sheet of step (1);
(4) coating on the green sheet of step (3) an insulating paste to form an insulating layer except for regions assigned for through holes;
(5) printing on the insulating layer of step (4) a circuit pattern of the copper paste of step (2) and filling said holes with the copper paste make a conductive connection through said holes;
(6) decomposing the binders by heating the product of step (5) under an oxidizing atmosphere at 400.degree.-850.degree. C.; and
(7) heating the product of step (6) at 850.degree.-1050.degree. C. under a reducing atmosphere for a period of time sufficient to reduce copper oxide, sinter the product of step (6) and crystallize said glasses.
After step (5), pairs of steps (4) and (5) are repeated to make multilayer circuit boards.
REFERENCES:
patent: 2993815 (1961-07-01), Treptow
patent: 3914517 (1975-10-01), Pirooz
patent: 4191789 (1980-03-01), Brown
patent: 4234367 (1980-11-01), Herron
patent: 4490429 (1984-12-01), Tosaki
patent: 4551357 (1985-11-01), Takeuchi
patent: 4627160 (1986-12-01), Herron
patent: 4629681 (1986-12-01), Takada
patent: 4671928 (1987-06-01), Herron
patent: 4695403 (1987-09-01), Nishimura
P. L. Toch, J. Godrick and B. A. Shaw, Failure Mechanism and Process Control Requirements in the Production of Copper Multilayer Interconnect Boards, pp. 602-608, 1986.
Kondo Kazuo
Morikawa Asao
Shiromizu Hisaharu
Sukegawa Tsuneyuki
Beck Shrive
Dang Vi D.
NGK Spark Plug Co.
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