4. Metal fusion bonding
  5. Process
  6. Bonding nonmetals with metallic filler

Trevor C. Gainey

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Encapsulation of electronic components

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Mounting of electronic devices

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Packaging of electronic devices

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Solder joint

Metal fusion bonding – Process – Bonding nonmetals with metallic filler
Patent

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Support for semiconductor bond wires

Active solid-state devices (e.g. – transistors – solid-state diode – Lead frame – With structure for mounting semiconductor chip to lead frame
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1056135

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