Solder joint

Details Solder joint Solder joint

1987-08-28

1988-12-27

Godici, Nicholas P.

Metal fusion bonding

Process

Bonding nonmetals with metallic filler

228124, 228174, 228254, 22826312, 228123, 156 87, 29832, 29840, B23K 120, B23K 3102

Patent

active

047935430

ABSTRACT:
A power component such as a power transistor is mounted on an insulating substrate of, e.g., beryllia by using a thick film deposition technique. A first layer (2) is deposited and a second layer (3) is deposited over the first layer to produce a regular series of troughs and lands, in the preferred embodiment troughs and ridges, whereby voiding in the solder bond is minimized if not eliminated to thus maintain a good thermal conductivity between the component and the substrate.

REFERENCES:
patent: 3934336 (1976-01-01), Morse
patent: 4409278 (1983-10-01), Jochym
patent: 4413766 (1983-11-01), Webster
patent: 4540462 (1985-09-01), Mizunoya et al.
patent: 4650107 (1987-03-01), Keser
Research Disclosure, "Low Stressed Bonding Structure . . . ", No. 270, Oct. 1986.
Semiconductor International, Sep. 1984, "Thermal Effect of Die Bonding".

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