Mounting of electronic devices

Details Mounting of electronic devices Mounting of electronic devices

1993-10-26

1996-08-27

Nimmo, Morris H.

Electricity: conductors and insulators

Boxes and housings

Hermetic sealed envelope type

257692, H02G 308

Patent

active

055503233

ABSTRACT:
In contrast to the conventional automated bonding system, an electronic device (10) is mounted within a surrounding ring frame (12, 14) of insulating material by means of a plurality of individually applied tapes or ribbons (16) of electrically conductive material. A protective coating (18) may be applied to the assembly after bonding.

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