Method for soldering electronic components

Details Method for soldering electronic components Method for soldering electronic components

1994-04-06

1996-06-18

Seidel, Richard K.

Metal fusion bonding

Process

With protecting of work or filler or applying flux

B23K 3102

Patent

active

055269788

ABSTRACT:
A method for soldering an electronic component capable of accomplishing satisfactory soldering of an electronic component using paste solder even in an oven constructed into a non-closed structure which causes flowing of an ambient atmosphere. Dehumidified air is introduced through a dehumidified air inlet section into the oven to keep a dehumidified atmosphere in the oven, to thereby prevented activity of flux contained in the paste flux from being deteriorated.

REFERENCES:
patent: 4580716 (1986-04-01), Barresi et al.
patent: 5163599 (1992-11-01), Mishina et al.
patent: 5180096 (1993-01-01), Kondo
patent: 5232145 (1993-08-01), Alley et al.
patent: 5242096 (1993-09-01), Tsunabuchi et al.
patent: 5259546 (1993-11-01), Volk
Loten mit "Profil." In: productronic, 1989. Nr. 4, S.26,28, Die Fachzeit-schrift fur Elektronik-Fertigung und Test.
Hwang, De. Jennie, Soldering with Controlled Atmospheres, Circuits Manufacturing , May 1990, pp. 64-65.
Arslancan, Ahmet N., IR Solder Reflow in Controlled Atmosphere of Air and Nitrogen, SMTCON Technical Proceedings, Apr. 1990 pp. 301-308.

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