4. Heat exchange
  5. With retainer for removable article
  6. Electrical component

Toshifumi Sano

Inventor

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Cooling structure

Heat exchange – Heat transmitter
Patent

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Cooling structure for electronic circuit package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Patent

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Liquid cooling system for integrated circuit chips

Heat exchange – With retainer for removable article – Electrical component
Patent

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Semiconductor package

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With provision for cooling the housing or its contents
Patent

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Profile ID: LFUS-PAI-P-1084372

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