Liquid cooling system for integrated circuit chips

Details Liquid cooling system for integrated circuit chips Liquid cooling system for integrated circuit chips

1986-11-18

1989-08-08

Lazarus, Ira S.

Heat exchange

With retainer for removable article

Electrical component

165185, 361387, F28F 700, H05K 720

Patent

active

048543772

ABSTRACT:
A cooling system for integrated circuit chips comprises a substrate, a plurality of integrated circuit chips mounted on a first surface of the substrate and a second surface opposite to the first surface thereof, a heat conductive means having a first surface and a second, flat surface opposite to the first surface, a layer of thermally conductive bonding material between the second surface of the substrate and the first surface of the heat conductive means, and a heat exchanger having a flat surface and provided with inlet and outlet means to permit liquid coolant to flow through the heat exchanger in contact with the flat surface. The heat exchanger is removably mounted to the heat conductive means with the flat surface thereof being in close proximity to the second surface of the heat conductive means. The thermally conductive bonding material allows a low thermal resistance contact to be made between the substrate and the heat conductive means and allows the latter to present a flat plane to the heat exchanger so that a low thermal resistance contact can also be established therebetween.

REFERENCES:
patent: 4072188 (1978-02-01), Wilson et al.
patent: 4381032 (1983-04-01), Cutchaw
patent: 4639829 (1987-01-01), Ostergren et al.
patent: 4649990 (1987-03-01), Kurihara et al.
patent: 4685211 (1987-08-01), Hagihara et al.
IBM Tech. Disclosure Bulletin, "Heatsink design for cooling modules in a forced air environment," vol. 22, No. 6, Nov. 1979.
IBM Technical Disclosure Bulletin, "Method of Effective Cooling of a High Power Silicon Chip", vol. 20, No. 4 Sept. 1977.

Affiliated with

Also associated with

Rating

Liquid cooling system for integrated circuit chips does not yet have a rating. At this time, there are no reviews or comments for this patent.

If you have personal experience with Liquid cooling system for integrated circuit chips, we encourage you to share that experience with our LandOfFree.com community. Your opinion is very important and Liquid cooling system for integrated circuit chips will most certainly appreciate the feedback.

Rate now

Comments { 0 }

Profile ID: LFUS-PAI-O-898858