Cooling structure for electronic circuit package

Details Cooling structure for electronic circuit package Cooling structure for electronic circuit package

1993-09-29

1995-01-24

Thompson, Gregory D.

Electricity: electrical systems and devices

Housing or mounting assemblies with diverse electrical...

For electronic systems and devices

165 804, 165185, 165908, 174 163, 174 151, 257714, 361698, 361705, H05K 720

Patent

active

053846877

ABSTRACT:
A cooling structure is used for forced cooling of an electronic circuit package. The cooling structure has a bottom heat radiation plate on which the electronic circuit package is mounted, a nozzle for jetting coolant toward the bottom heat radiation plate, a first vertical heat radiation plate mounted on the bottom heat radiation plate and disposed so as to surround the nozzle openings are formed in the first vertical heat radiation plate for again jetting coolant jetted from the nozzle. A second vertical heat radiation plate is mounted on the bottom heat radiation plate and is disposed so as to surround the first vertical heat radiation plate at least in an opposing relationship to the openings. The coolant jetted from the openings collides with and removes heat from the second vertical heat radiation plate.

REFERENCES:
patent: 4590538 (1986-05-01), Cray, Jr.
patent: 4733293 (1988-03-01), Gabuzda
patent: 4920574 (1990-04-01), Yamamato et al.
patent: 4977444 (1990-12-01), Nakajima et al.
patent: 5264984 (1993-11-01), Akamatsu
S. Oktay et al., "A Conduction-Cooled Module for High-Performance LSI Devices", IBM J. Res. Develop. vol. 26, No. 1, Jan. 1982, pp. 55-66.
IBM Technical Disclosure Bulletin, vol. 32, No. 8A, Jan. 1990, pp. 168-170.

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