4. Electricity: conductors and insulators
  5. Boxes and housings
  6. Hermetic sealed envelope type

Tong Hsing Electronic Industries Ltd.

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Image sensing device and packaging method thereof

Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Having light transmissive window
Reexamination Certificate

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Pin grid array package

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Patent

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Profile ID: LFUS-PAI-P-1170733

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