Image sensing device and packaging method thereof

Details Image sensing device and packaging method thereof Image sensing device and packaging method thereof

2008-08-01

2010-10-12

Blum, David S (Department: 2813)

Semiconductor device manufacturing: process

Packaging or treatment of packaged semiconductor

Having light transmissive window

C438S106000, C438S107000, C257SE31110

Reexamination Certificate

active

07811861

ABSTRACT:
An image sensing device and packaging method thereof is disclosed. The packaging method includes the steps of a) providing an image sensing module, having a light-receiving region exposed, on a first substrate; b) forming a plurality of first contacts around the light-receiving region on the image sensing module; c) providing a second substrate, having a plurality of second contacts corresponding to the plurality of first contacts and an opening for allowing the light-receiving region to be exposed while the second substrate is placed over the image sensing module, the plurality of second contacts being disposed around the opening; d) connecting the plurality of first contacts and the plurality of second contacts; and e) disposing a transparent lid above the light-receiving region, on a side of the second substrate which is opposite to the plurality of second contacts.

REFERENCES:
patent: 2002/0048842 (2002-04-01), Lin et al.
patent: 2009/0032925 (2009-02-01), England
patent: 2009/0117689 (2009-05-01), Chen
patent: 2009/0256229 (2009-10-01), Ishikawa et al.
patent: 2010/0008203 (2010-01-01), Furuyashiki et al.

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