4. Metal fusion bonding
  5. Process
  6. With shaping

Tomoe Suzuki

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Method for manufacturing printed wiring substrates, metal...

Stock material or miscellaneous articles – Sheet – web – or layer weakened to permit separation through...
Reexamination Certificate

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Method for manufacturing printed wiring substrates, metal...

Cutting – Processes – Cutting part way through from opposite sides of work
Reexamination Certificate

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Substrate with top-flattened solder bumps and method for...

Metal fusion bonding – Process – With shaping
Reexamination Certificate

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Substrate with top-flattened solder bumps and method for...

Active solid-state devices (e.g. – transistors – solid-state diode – Combined with electrical contact or lead – Bump leads
Reexamination Certificate

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Profile ID: LFUS-PAI-P-2712568

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