Cutting – Processes – Cutting part way through from opposite sides of work
Reexamination Certificate
2005-12-20
2005-12-20
Lam, Cathy F. (Department: 1775)
Cutting
Processes
Cutting part way through from opposite sides of work
C083S879000, C083S880000
Reexamination Certificate
active
06976415
ABSTRACT:
The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.
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Derwent English Abstracts for JP 2001-133431.
Derwent English Abstract for JP 2000-101245.
Sato Kazuhisa
Suzuki Tomoe
Yamasaki Kozo
Yuri Shinji
Lam Cathy F.
NGK Spark Plug Co. Ltd.
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