Stock material or miscellaneous articles – Sheet – web – or layer weakened to permit separation through...
Reexamination Certificate
2005-03-29
2005-03-29
Lam, Cathy F (Department: 1775)
Stock material or miscellaneous articles
Sheet, web, or layer weakened to permit separation through...
C428S134000, C428S136000, C428S209000, C428S901000
Reexamination Certificate
active
06872436
ABSTRACT:
The invention provides a method for manufacturing printed wiring substrates which can manufacture printed wiring substrates each having resin dielectric layers of uniform thickness and excellent surface flatness while maintaining favorable cutting performance in a dicing step. A multi-printed wiring-substrate panel is manufactured which includes a metal plate having a first main surface and a second main surface, and resin dielectric layers disposed on the first and second main surfaces. The metal plate has first depression portions and second depression portions. The first depression portions are opened at the first main surface and arranged discontinuously along predetermined cutting lines. The second depression portions are opened at the second main surface and arranged discontinuously along the predetermined cutting lines. The multi-printed wiring-substrate panel is cut along the predetermined cutting lines into a plurality of printed wiring substrates.
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Sato Kazuhisa
Suzuki Tomoe
Yamasaki Kozo
Yuri Shinji
Brinks Hofer Gilson & Lione
Lam Cathy F
NGK Spark Plug Co. Ltd.
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