Semiconductor device manufacturing: process – Packaging or treatment of packaged semiconductor – Incorporating resilient component
Reexamination Certificate
2007-01-09
2007-01-09
Geyer, Scott B. (Department: 2812)
Semiconductor device manufacturing: process
Packaging or treatment of packaged semiconductor
Incorporating resilient component
C438S108000, C257SE21499
Reexamination Certificate
active
11114392
ABSTRACT:
Electronic assemblies and methods for forming assemblies are described. One embodiment includes a method of forming an electronic assembly, including forming a plurality of first solder bumps on one of a substrate and an interposer. The substrate and interposer are positioned so that the first solder bumps are located between the substrate and the interposer. A gap control structure is positioned between the substrate and the interposer. A first reflow operation that reflows and then solidifies the first solder bumps is performed. The first reflow operation couples the interposer to the substrate. A plurality of second solder bumps are formed on one of the interposer and a die. The interposer and die are positioned so that the second solder bumps are located between the interposer and the die. A second reflow operation that reflows and then solidifies the second solder bumps is performed. The second reflow operation couples the die to the interposer. The second reflow operation also reflows the first solder bumps, and the gap control structure between the substrate and the interposer inhibits a change in a gap between the substrate and the interposer during the second reflow operation. Other embodiments are described and claimed.
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Lappin Tom M.
Narkhede Madhuri R.
Geyer Scott B.
Konrad Raynes & Victor LLP
Raynes Alan S.
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