Asymmetric transfer molding method and an asymmetric encapsulati

Details Asymmetric transfer molding method and an asymmetric encapsulati Asymmetric transfer molding method and an asymmetric encapsulati

1999-02-22

2000-11-07

Picardat, Kevin M.

Semiconductor device manufacturing: process

Making device or circuit emissive of nonelectrical signal

Packaging or treatment of packaged semiconductor

438 22, 438124, 438127, H01L 2100

Patent

active

061435813

ABSTRACT:
A method of encapsulating an article having first and second surfaces, includes positioning a first molding section in a sealing relationship with the first surface of the article and positioning a second molding section adjacent the second surface of the article. The first molding section is filled first thereby forcing the second surface of the article into a sealing engagement with the second molding section. The second molding section is then filled.

REFERENCES:
patent: 4744637 (1988-05-01), Sekimura et al.
patent: 5070041 (1991-12-01), Katayama et al.
patent: 5270573 (1993-12-01), Takayanagi et al.
patent: 5766987 (1998-06-01), Mitchell et al.
patent: 5874324 (1999-02-01), Osada
John H. Lau(Editor), Chip on Board Technologies for Multichie Modules; 1994 pp. 2, 3, 24-27, 30-33, 330-337; Van Nostrand Reinhold, an International Thomson Publishing Company.

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