4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. With contact or lead

Todd G. Nakanishi

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active

Coplanar linear dual switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – With contact or lead
Patent

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Durable substrate subassembly for transistor switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Parallel dual switch module

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent

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Ultrasonic welding mask

Metal fusion bonding – Means to apply vibratory solid-state bonding energy to work
Patent

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Profile ID: LFUS-PAI-P-608173

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