Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – For plural devices
Patent
1998-04-06
1999-04-20
Wojciechowicz, Edward
Active solid-state devices (e.g., transistors, solid-state diode
Housing or package
For plural devices
257724, 257706, 257107, H01L 2334
Patent
active
058959742
ABSTRACT:
A durable substrate subassembly for a high power transistor switching module. The substrate subassembly is durable because wire bonds to the semiconductor device electrodes are replaced with a soldered metal/ceramic composite conductor. The part of the composite conductor contacting the semiconductor device has a coefficient of thermal expansion close to that of the semiconductor device. The metal of the composite conductor is preferably a strip of copper foil. The ceramic portion is a layer of alumina on the copper foil that is generally coextensive with the semiconductor device electrodes.
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Bramel Michael D.
Eytcheson Charles Tyler
Lachenmaier Frank David
Nakanishi Todd G.
Clark S. V.
Delco Electronics Corp.
Funke Jimmy L.
Wojciechowicz Edward
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