4. Active solid-state devices (e.g., transistors, solid-state diode
  5. Housing or package
  6. Insulating material

Tien Yue Wu

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Integrated circuit package

Electricity: electrical systems and devices – Housing or mounting assemblies with diverse electrical... – For electronic systems and devices
Reexamination Certificate

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Integrated circuit package including a heat sink and an adhesive

Active solid-state devices (e.g. – transistors – solid-state diode – Housing or package – Insulating material
Patent

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Protective cover plate for flip chip assembly backside

Electricity: conductors and insulators – Boxes and housings – Hermetic sealed envelope type
Reexamination Certificate

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Profile ID: LFUS-PAI-P-1497589

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